About this Data Sheet

Purpose and Scope

The GM02SP is a complete LTE Cat M1/NB1/NB2 module including baseband, RF, low-power GNSS and memory, for the design of narrowband low data rate M2M and IoT devices for wide deployment. This document provides technical information about GM02SP LGA module. GM02SP is based on Sequans’s Monarch 2 platform.

Who Should Read this Document?

This document is intended for engineers who develop User Equipment (UE) for LTE systems, with embedded location processing using GNSS technology.

Changes in this Document

This revision 13 of the document supersedes revision 12.

Table 1. Revision history
Revision Date Changes from the previous version
13 Jan. 2026
  • New tape and reel figure to better show the packaging
  • New box and shipment labels
  • Added information about I²C
  • Remove band B14
  • Correction to GPIO behaviour in sleep mode
12 2025
  • New Frequency Bands table.
  • Rewritten Regulatory Approval section.
11 Oct. 2024
  • Reinstates UART3 and corresponding GPIOs
  • Add GM02SP vs SQN3430 GPIO cross-table
  • Remove mention of PULSE0/PULSE1 pads as those are not made available by software
  • Update the reflow profile and parameters in section 4.4 Storage and Mounting
10 July 2024
  • New P/N GP02RBAQRG
9 June 2024
  • Add minimum rise time value for VBAT
  • Change to marking and packing information to reflect multiple possible countries of origin
  • Add various remarks on SPI operation
  • Remove B71 (600 MHz) from the list of supported bands
  • Precisions on RESETN voltage measurement
  • Change the description of the UARTs' default configuration
  • Add temperature measurement accuracy in the Thermal Consideration Section
8 Jan. 2024
  • SIM_VCC output current is increased to 30 mA (instead of 2)
  • Added a timing diagram in the Power section, as well as a warning related to VBAT levels and power-up slew-rate
  • New section on MTTF calculation and figure
7 Oct. 2023
  • Remove mentions of a fourth UART
  • Repurposed pin 71 from DNC to GND to ease PCB design
  • Added regulatory information for ACMA, FCC, ISED, RED, UKCA
  • Added two P/N: GP02RBAQRE and GP02RBAQRF
  • Added reflux water washing procedure
6c Jan. 2023 Add new P/N and corrections to table 2. Adjust the weight in section 4
6b Oct. 2022 Erratum to section 1.4
6a Sept. 2022 Erratum on software version in table 2
6 Aug. 2022 Mechanical characteristics changes to account for new hardware (thickness) in chapter 4
5 July 2022
  • Updated mechanical specifications (figure 9)
  • Updated packing information (figures 11 and 12)
4 April 2022
  • Created chapter 5 on GNSS Characteristics
  • Completed FCC Regulatory Information section
3 March 2022
  • Updated packaging information in chapter 4
  • Added FCC and ISED Regulatory Approval sections
2 Jan. 2022

General Description

The Monarch 2 GM02SP is an LTE Cat M1/NB1/NB2 module based on Sequans' second generation Monarch 2 chip platform. GM02SP is a total module solution, including a complete, Single-SKU™ RF front end for deployment in any band worldwide, and an integrated EAL5+ Secure Element (SE) enabling the integration of the SIM inside the module with zero compromise on security while lowering cost and reducing complexity. The GM02SP is part of Sequans next generation "S" family of modules, featuring a very small yet cost-effective form factor that requires no external components. The “P” variant in the part number stands for the additional Low-Power GNSS functionality. The GM02SP maintains pin-to-pin compatibility w/r to the legacy GM02S.

The GM02SP leverages Sequans’s 15-plus years of experience in 4G+ technologies and incorporates Sequans’s carrier-approved LTE protocol stack and a software suite amongst the most mature in the industry. The GM02SP is part of Sequans’s next generation "S" family of modules, featuring a very small and cost-effective form factor which requires no external components. The GM02SP inherits Monarch’s already certified LTE-M and NB-IoT stack and delivers a significantly improved performance and lower power consumption thanks to Sequans’s second generation Monarch 2 chip and the new module architecture.

Sequans’s technology, both hardware and software, is completely owned by Sequans, ensuring a fast time to market and the lowest total cost of ownership for device makers.

Frequency Bands

The GM02SP supports the following bands:
Table 2. Bands supported by the GM02SP, names and limits thereof.
Band Name Limits (MHz)
B1 IMT 1920 – 1980
B2 PCS 1850 – 1910
B3 DCS 1710 – 1785
B4 AWS-1 1710 – 1755
B5 Cellular 824 – 849
B8 Extended GSM 900 880 – 9151
B12 Lower SMH 699 – 716
B13 Upper SMH 777 – 787
B17 Lower SMH 704 – 716
B18 Lower 800 815 – 830
B19 Upper 800 830 – 845
B20 800 Digital Dividend 832 – 862
B25 Extended PCS 1850 – 1915
B26 Extended Cellular 814 – 849
B28 APT 703 – 748
B66 Extended AWS 1710 – 1780
B85 Extended Lower SMH 698 – 716

The GM02SP monitors the L1 band (at 1,575.42 MHz) for GNSS applications.

Applications

The GM02SP is ideal for adding LTE-M and/or NB-IoT LTE connectivity to narrow band, low data rate M2M and IoT devices such as utility meters, industrial sensors, health and fitness appliances, asset trackers, and many additional devices in smart home, smart city, and wearable applications.

The GM02SP can also be used as a slim modem controlled by an external MCU via its UART. Alternatively, the GM02SP can execute applets on its embedded MCU.

The LP-GNSS functionality uses on-chip or cloud-assisted mode to locate the IoT device. The GNSS processing tracks the GPS and Galileo constellations and can be activated when the LTE modem is not in function (AT+CFUN=0).

Block Diagram

Figure 1. GM02SP Block Diagram


Note:
Two distinct antennas are required in the design. LTE and GNSS RF paths share the same RF front-end block after an RF switch. To get the best GNSS performance, both an external SAW filter and a LNA are strongly recommended.

General Features

Physical Characteristics LGA module, 120 pads.

Size: 16.3 × 17 × 2.3 mm
Temperature Range

Operation temperature range: -40 to +85 °C

Storage: MSL3

Power Supply

Voltage range for RF compliance: 2.5 to 5.5 V

Functional voltage range: 2.2 to 5.5 V

Tx Power +23 dBm in each band
Interfaces
  • Dual (U)SIM Card Interface: support for external, removable or fixed UICC. Support for integrated UICC (iUICC) with a dedicated p/n;
  • 4x High-Speed UART Interfaces with flow control, up to 921600 bauds;
  • GPIOs, I²C, SPI, PWM, I²S/PCM, ADC;
  • GNSS RF input.
SMS Text and PDU modes
Firmware Upgrade UART interface, FOTA, support of full and differential firmware upgrade
RoHS/REACH All hardware components fully comply with EU RoHS and REACH directives, bromine-free
GNSS Features Low-power location processing, performed either fully on-chip, or with cloud assistance*.

*Cloud assistance = satellites’ ephemerides and almanacs downloaded from cloud into the device.

Important:
The GNSS functionality is available only if the LTE modem is off (AT+CFUN = 0).
LTE Features
  • 3GPP LTE Release 13/14 Cat M1/NB1/NB2 compliant.
  • LTE Cat M1: 1.1 Mbps / 0.3 Mbps UL/DL throughput.
  • LTE Cat NB1: 62.5 kbps / 27.2 kbps UL/DL throughput.
  • LTE Cat NB2: 105 kbps / 80 kbps UL/DL throughput.

Available Part Numbers

GM02SP’s ECCN is 5A991.

Table 3. Available Part Numbers
Part Number Hardware Version Software Build (ATI1) UE Version (ATI1) PTCRB Model Name / Model SVN Availability Status
GP02RBAQRC HW Rev. 3 LR 8.0.6.3 UE 8.0.6.3 GM02SP 13 Obsolete, engineering release, not available any more
GP02RBAQRD
GP02RBAQRE LR 8.2.0.0 UE 8.2.0.0 13
GP02RBAQRF LR 8.2.0.3 UE 8.2.0.3 15 Available, OTP unlocked
GP02RBAQRG LR 8.2.1.0 UE 8.2.1.0 19

Interfaces

The GM02SP provides electric interfaces connecting it to the external parts, such as communication I/O ports, GPIO and antenna RF I/O. This chapter provides information about all these interfaces.

Power supply pins and details thereof are detailed in section Electrical, RF and Thermal Characteristics.

Important:
Please refer to this data sheet’s companion MS-Excel file for details on each pin’s:
  • Default assigned function;
  • State during low power modes;
  • Configuration with AT commands;
  • Pull status and requirements.

Pin Assignment

Figure 2. GM02SP Module Pads Assignments


UART

The GM02SP has three available UARTs to communicate with the application processor.

Table 4. UART Signals
Pad # Pad Name Primary Function Alternate2 Function Power Group Dir. Pad type3 Reset state
36 GPIO12/TXD0 TXD0 GPIO12 PVDD_1V8 In/Out BIDIR High-Z
In for primary function, UART0
34 GPIO13/RXD0 RXD0 GPIO13 PVDD_1V8 In/Out BIDIR Out
Out for primary function, UART0
35 GPIO14/CTS0 CTS0 GPIO14 PVDD_1V8 In/Out BIDIR Out
Out for primary function, UART0
33 RTS0 RTS0 N/A PMU_5V In IN High-Z
Wake signal enabled by default.
32 TXD1 TXD1 N/A PVDD_1V8 In BIDIR High-Z
UART1
30 RXD1 RXD1 N/A PVDD_1V8 Out BIDIR Out
UART1
31 CTS1 CTS1 N/A PVDD_1V8 Out BIDIR Out
UART1
29 RTS1 RTS1 N/A PMU_5V In IN High-Z
Wake signal enabled by default.
28 GPIO15/TXD2 TXD2 GPIO15 PVDD_1V8 In/Out BIDIR High-Z
In for primary function, UART2
26 GPIO16/RXD2 RXD2 GPIO16 PVDD_1V8 In/Out BIDIR Out
Out for primary function, UART2
27 GPIO17/CTS2/DCD0 GPIO17 CTS2/ DCD0 PVDD_1V8 In/Out BIDIR Out
UART2
25 GPIO18/RTS2/DSR0 GPIO18 RTS2/ DSR0 PVDD_1V8 In/Out BIDIR High-Z
UART2
24 GPIO19/TXD3 GPIO19 TXD3 PVDD_1V8 In/Out BIDIR HighZ
In for primary function, UART3
22 GPIO20/RXD3 GPIO20 RXD3 PVDD_1V8 In/Out BIDIR Out
Out for primary function, UART3
21 GPIO21/CTS3 GPIO21 CTS3 PVDD_1V8 In/Out BIDIR Out
UART3
23 GPIO22/RTS3 GPIO22 RTS3 PVDD_1V8 In/Out BIDIR Out
UART3
Note:
See section Power for behaviour of I/Os in Sleep and Deep Sleep mode.

UART Default Configuration

UART interfaces have three function modes:
  • The Host-Modem interface, also named ‘AT mode’, configures and exchanges data with the modem using standard or proprietary AT commands. This mode requires a high-speed UART port with flow control.
  • The Modem Console interface copies the logs from the LTE modem.
  • The Debug interface (also referred to as DCP) is needed by the DM Tool during design verification or debugging. This interface can be used to upgrade the software using SFU.

The default configuration appears in Table 5.

Table 5. UART Ports Default Configuration
UART# Baudrate Flow Control Application Wake Source Manufacturing Upgrade
0 115200 Enabled AT Yes Yes
1 921600 Enabled AT Yes Yes
2 115200 Disabled Console No No

Refer to the Module Manufacturing Guidelines for overriding this default configuration.

UART wiring

The GM02SP complies to the DCE-DTE convention for UART lines. It is designed as a DCE (Data Communication Equipment).

The output from the device at one end of the link connects to the corresponding input at the other end of the link and vice versa. The Figure 3 represents the typical implementation for the UART connection (including hardware flow control in case of high-speed UARTs).

The DCE (Data Communication Equipment) device communicates with the customer application (DTE) using the following signals:
  • Port TxD on the application board side sends data to the GM02SP's TxD signal line.
  • Port RxD on the application board side receives data from the GM02SP's RxD signal line.
  • CTS0, CTS1, CTS2, CTS3: Clear-To-Send signals of resp. UART0, UART1, UART2, UART3 (active low). To be connected to the CTS of the remote UART device. See Figure 3.

    Leave CTS unconnected if hardware flow control is not used.

  • RTS0, RTS1, RTS2, RTS3: Ready-To-Send signals of resp. UART0, UART1, UART2, UART3 (active low). To be connected to the RTS of the remote UART device. Tie to a 1 kΩ pull-down when flow control is not used. If connected to an external part (like a RS 232 driver), the user must insure that the part presents a low level to the GM02SP See Figure 3.
Important:
When pull-ups are recommended or required on UART lines, care must be taken that the DC power source pulling-up the signal is on even when the module is in deep sleep mode. For example, never use the GM02SP 1V8 signal (which is turned off in deep sleep mode).

Figure 3 represents the typical implementation for hardware flow control.

Figure 3. UART Connection Implementation (with Hardware Flow Control)


Please refer to the System Integration Guide document for more details about the possible implementation.
Important:
Designs should provide access to UART 1 with hardware flow control to facilitate debug and upgrade during the development of the product. Simple UART connectors or, more conveniently, dedicated UART-to-USB converter ICs paired with a USB connector, as implemented in the EVK reference design, suffice.

Various UART-to-USB converters were tested on GM02S/GM02SP modules, including the Exar XR21V1410, FTDI FT234XD or FTDI FT4232H. Implementation examples can be found in reference designs schematics.

USIM Interfaces

SIM0 Interface

This is the main external SIM interface. It can be used with removable or non-removable SIM cards or with soldered SIM chips. The modem manages the SIM’s power supply to keep consumption as low as possible.
Note:
See Section Power for behaviour of I/Os in Sleep and Deep Sleep mode.
Important:
The GM02SP only supports 1.8 V SIMs.
Table 6. SIM0 Signals
Pad # Pad Name Primary Function Power Group Dir. Pad type 4 Reset State
42 SIM0_CLK SIM0_CLK PVDD_1V8 Out BIDIR Out
45 SIM0_DETECT5 SIM0_DETECT PMU_5V In IN High-Z
44 SIM0_IO SIM0_IO PVDD_1V8 In/Out BIDIR High-Z
43 SIM0_RSTN SIM0_RSTN PVDD_1V8 Out BIDIR Out
73 SIM0_VCC6 SIM0_VCC PVDD_1V8 Out SUPPLY Out7

SIM1 Interface

This GM02SP ’s interface to a second SIM is typically meant for soldered SIM chips (since it lacks SIM detect and SIM VCC). If the board makes use of a single SIM, it should be connected to the main SIM interface (see Section SIM0 Interface above).
Note:
SIMs connected to the SIM 1 interface need an external 1.8 V power source, since the SIM 1 group lacks a VCC output. It is thus recommended to use SIM 0, except if a dual SIM solution is mandatory.
Note:
See Section Power for behaviour of I/Os in Sleep and Deep Sleep mode.
Table 7. SIM1 Signals
Pad # Pad Name Primary Function Alternate Function Power Group Dir. Pad Type 8 Reset state
40 GPIO26/SIM1_CLK GPIO26 SIM1_CLK PVDD_1V8 Out BIDIR Out
41 GPIO27/SIM1_RESETN GPIO27 SIM1_RESETN PVDD_1V8 Out BIDIR Out
39 GPIO25/SIM1_IO GPIO25 SIM1_IO PVDD_1V8 In/Out BIDIR High-Z

Miscellaneous Hardware Considerations

  • Use a 100 nF decoupling capacitor on SIM_VCC.
  • Use a 4.7 kΩ pull-up resistor between SIM_VCC and SIM_IO.
  • The SIM connector should be located as close as possible to the module.
  • Please ensure ground continuity between the SIM card and the module.
  • If the application handles SIM card hot swapping, the SIM slot must contain a card detector in order for the software to process the event immediately. Default software configuration is to support SIM_DETECT.
  • If the SIM card tray does not support SIM_DETECT (not recommended), keep the SIM_DETECT signal high and configure the module for SIM card detection using polling mode.

I²C

Note:
See Section Power for behaviour of I/Os in Sleep and Deep Sleep mode.
Table 8. I²C Pad Details
Pad # Pad Name Primary Function Alternate Function Power Group Dir. Pad type 9 Reset State
95 GPIO23/I2C_SDA GPIO23 I2C_SDA PVDD_1V8 In/Out BIDIR High-Z
97 GPIO24/I2C_SCL GPIO24 I2C_SCL PVDD_1V8 In/Out BIDIR High-Z
Note:
I²C is only supported by the PXL SDK using software emulation.
Note:
When enabled, both I2C_SDA and I2C_SDL must be pulled up using a 4.7 kΩ resistor connected to an external power supply.

PCM

Note:
See section Power for behaviour of I/Os in Sleep and Deep Sleep mode.
Table 9. PCM Pad Details
Pad # Pad Name Primary Function Alternate10 Function Power Group Dir. Pad type 11 Reset State
96 GPIO4/PCM_CLK GPIO4 PCM_CLK PVDD_1V8 In/Out BIDIR High-Z
98 GPIO3/PCM_RXD GPIO3 PCM_RXD PVDD_1V8 In/Out BIDIR High-Z
99 GPIO5/PCM_FS GPIO5 PCM_FS PVDD_1V8 In/Out BIDIR High-Z
100 GPIO6/PCM_TXD GPIO6 PCM_TXD PVDD_1V8 In/Out BIDIR High-Z
Note:
PCM is reserved for future use

SPI

Note:
See section Power for behaviour of I/Os in Sleep and Deep Sleep mode.
Table 10. SPI Pad Details
Pad # Pad Name Primary Function Alternate12 Function Power Group Dir. Pad type 13 Reset state
3 GPIO7/SPI_SDI GPIO7 SPI_SDI PVDD_1V8 In/Out BIDIR High-Z
4 GPIO8/SPI_SDO GPIO8 SPI_SDO PVDD_1V8 In/Out BIDIR High-Z
2 GPIO9/SPI_CLK GPIO9 SPI_CLK PVDD_1V8 In/Out BIDIR High-Z
5 GPIO10/SPI_CSN1 GPIO10 SPI_CSN1 PVDD_1V8 In/Out BIDIR High-Z
7 GPIO11/SPI_CSN214 GPIO11 SPI_CSN2 PVDD_1V8 In/Out BIDIR High-Z
Note:
SPI is only available using the PXL SDK.
To enable SPI, GPIO 7, 8, 9, 10 and 11 should be disabled.

When SPI is enabled, SPI_SDO (Serial Data Output) is an INPUT which is connected to the slave DO (Data Output). Conversely, SPI_SDI (Serial Data Input) is an OUTPUT connected to the slave's DI (Data Input).

GPIO

32 GPIOs are available on the GM02SP: GPIO1 to GPIO27 and GPIO31 to GPIO35. The GPIOs listed in Table 11 are not enabled by default. Their states are controlled by software.
Important:
GPIO28 has a dedicated use. Internally, GPIO28 is used to select between the LTE and the GNSS RF input signals. GPIO28 should be connected to the external GNSS LNA enable signal, if applicable. GPIO28 is high when GNSS is selected.
Table 11. GPIO pads detail
GPIO Range Default State
GPIO3 to GPIO11 Disabled
GPIO17 to GPIO28 Disabled
GPIO31 to GPIO35 Disabled

The GPIOs are documented in this data sheet according to their shared or assigned function. In addition to the GPIO, five wake signals are also available (see section Other Signals).

GM02SP GPIO to SQN 3430 GPIO Number Crosstable

AT commands such as AT+SMGI or AT+SMGT which test GPIOs behaviour do not take the GM02S's GPIO number as parameter, but an internal numbering given below. For example, to test GPIO1, the GPIO parameter given to AT+SMGI is 38.

Table 12. GM02SP to SQN 3430 GPIO Crosstable
GM02SP GPIO Number AT Command Corresponding Value
1 38
2 39
3 34
4 33
5 32
6 31
7 21
8 22
9 20
10 23
11 24
12 4
13 5
14 6
15 10
16 11
17 13
18 12
19 14
20 15
21 16
22 17
23 18
24 19
25 28
26 29
27 30
31 3
32 1
33 35
34 36
35 37

Other Signals

Table 13. GND and DNC pads
Pads Type Pads Number
GND 1, 6, 37, 38, 50, 51, 52, 54, 56, 58, 59, 61, 64, 65, 71,78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 91, 92, 93
DNC (Reserved) 15, 17, 53, 74, 75, 76, 77
Note:
See Section Power for behaviour of I/Os in Sleep and Deep Sleep mode.
Table 14. Other Signals (No Interface)
Pad # Name Primary Function Alternate15 Function Power Group Dir. Pad Type16 Reset State
72 ADC1 ADC1 (see below) N/A N/A In IN N/A
Analogue-Digital Converter (ADC, IN)
12 GPIO1/STATUS_LED STATUS_LED GPIO1 PVDD_1V8 In/Out BIDIR High-Z
Primary Function: Status LED (STATUS_LED, OUT)
13 GPIO2/PS_STATUS PS_STATUS GPIO2 PVDD_1V8 In/Out BIDIR High-Z
Primary Function: Power Saving status (PS_STATUS, OUT) enabled by default. Active high.
14 LNA_ENABLE LNA_ENABLE PVDD_1V8 In/Out BIDIR High-Z
Primary Function: External GNSS LNA enable signal
19 GPIO31/PWM0/ 19M2_OUT GPIO31 PWM0/19M2_OUT PVDD_1V8 In/Out BIDIR High-Z
18 GPIO32/PWM1 GPIO32 PWM1 PVDD_1V8 In/Out BIDIR High-Z
9 GPIO33/TX_IND TX_IND GPIO33 PVDD_1V8 In/Out BIDIR High-Z
Primary Function: Transmission indicator (TX_IND, OUT). Active high.
10 GPIO34/ANT_TUNE0 ANT_TUNE0 GPIO34 PVDD_1V8 In/Out BIDIR High-Z
Primary Function: Antenna tuning (ANT_TUNE0, OUT)
11 GPIO35/ANT_TUNE1 ANT_TUNE1 GPIO35 PVDD_1V8 In/Out BIDIR High-Z
Primary Function: Antenna tuning (ANT_TUNE1, OUT)
20 RESERVED/FFF_FFH RESERVED N/A PVDD_1V8 N/A BIDIR High-Z
Boot mode selection (FFF_FFH, IN). This pad needs a pull-down resistor by default.
15, 17, 53, 74, 75, 76, 77 RESERVED RESERVED N/A PVDD_1V8 N/A BIDIR N/A
Do not connect
46 RESETN RESETN N/A PMU_5V In IN In, Pull-up
Module HW reset signal. Active low. The minimum duration of a reset pulse on the RESETN signal is 100 µs.
16 RING0 RING0 N/A PVDD_1V8 In/Out BIDIR High-Z
UART0 ring line (RING0, OUT). Enabled by default with inverted polarity.
48 WAKE0 WAKE0 N/A PMU_5V In IN High-Z
Wake #0 input line (WAKE0, IN), disabled by default.
47 WAKE1 WAKE1 N/A PMU_5V In IN High-Z
Wake #1 input line (WAKE1, IN), disabled by default.
49 WAKE2 WAKE2 N/A PMU_5V In IN High-Z
Wake #2 input line (WAKE2, IN), disabled by default.
55 WAKE3 WAKE3 N/A PMU_5V In IN High-Z
Wake #3 input line (WAKE3, IN), disabled by default.
57 WAKE4 WAKE4 N/A PMU_5V In IN High-Z
Wake #4 input line (WAKE4, IN), disabled by default.

ADC Specifications

The ADC1 pin 72 has the following specifications:

Table 15. ADC Specifications
Parameter Value Unit
Resolution 14 bit
Dynamic Range 75 dB
Signal-to-Noise Ratio (SNR) 68 dB
Effective Number of Bits 11 bit
Input Signal Bandwidth 1.4 MHz
Full-scale Voltage 1.8 V
Input Resistance 40 kΩ

Don’t connect the ADC if it is not used (no need for resistive or capacitive termination).

JTAG

Note:
See Section Power for behaviour of I/Os in Sleep and Deep Sleep mode.
Table 16. JTAG pads Details
Pad # Pad Name Primary Function Power Group Direction Pad type 17 Reset State
69 JTAG_TCK JTAG_TCK PVDD_1V8 In IN In, Pull-down, Schmitt-trigger
67 JTAG_TDI JTAG_TDI PVDD_1V8 In IN In, Pull-up
68 JTAG_TDO JTAG_TDO PVDD_1V8 Out BIDIR Out, 0
66 JTAG_TMS JTAG_TMS PVDD_1V8 In IN In, Pull-up
70 JTAG_TRSTN JTAG_TRSTN PVDD_1V8 In IN In, Pull-down
Note:
The GM02SP does not support boundary scan (IEEE 1149.1) for production testing.

Antenna

Table 17. Antenna pad Details
Pad # Pad Name Direction Comments
90 LTE_ANT In/Out Main LTE Antenna, for Rx and Tx
94 GNSS_RF In GNSS RF input (L1 band)

Electrical, RF and Thermal Characteristics

Power

Important:
Details about power consumption can be found in the Software Release note corresponding to the product’s software version installed.

Power Pads Characteristics

Note:
Pad 1V8 is the reference voltage for I/Os. It can be used to provide power to small devices (100 mA maximum usage). This voltage is not available when the modem is in Deep Sleep mode. When the modem is in standby the voltage drops to 1.62 V as per Table 18.
Table 18. Power Pads
Pad # Pad Name Power Group Direction Min Value Typical Value Max Value
8 1V8 (see Note above) PVDD_1V8 Out 1.62 V 1.8 V 1.98 V
73 SIM_VCC 18 PVDD_1V8 Out 1.62 V 1.8 V 1.98 V
60, 62, 63 VBAT N/A In 2.2 V 5.5 V
Note:
Reference VBAT voltage range is 2.5 V to 5.5 V for RF-compliant operation and 2.2 V to 5.5 V for functional operation with possible degradation of RF performances.
Note:
The GM02SP does not use any boost or step-up DC/DC converters.

Power-on, Power-off and Reset

Figure 4. Power Cycle Timing


Table 19. Timing values
Name Description Min. Typ. Max. Unit
Vonmin Minimal ON Voltage 2.2 V
Trs VBAT Rise Time from Voffmax to Vonmin 119 10 000 µs
The value of Toffmin depends on the Voffmax voltage. The following table gives three typical figures:
Table 20. Toffmin vs. Voffmax
Name Description Value
Toffmin @ 50 mV Minimal OFF (VBAT ≤ Voffmax) time to insure complete reset when Voffmax = 50 mV 0.1 s
Toffmin @ 0.1 V Minimal OFF (VBAT ≤ Voffmax) time to insure complete reset when Voffmax = 0.1 V 0.5 s
Toffmin @ 0.2 V Minimal OFF (VBAT ≤ Voffmax) time to insure complete reset when Voffmax = 0.2 V 1 s
CAUTION:
VBAT must always be at least equal to Vonmin during normal operation. Once VBAT has dropped below this threshold, always ensure the voltage keeps on dropping down to Voffmax and remains low for at least Toffmin. Failure to comply, as well as failure to meet the maximum VBAT rising time requirement (Trs) during power-on, can result in erratic behaviour.
Figure 5. Typical Timing Diagram for Power-Up Sequence


Important:
The 1V8 power signal can remain low up to 370 μs after the VBAT rising edge
Figure 6. Typical Timing Diagram for Reset Sequence


Note:
since RESETN is pulled-up internally, RESETN does not need to be held low after VBAT is established, as shown in Figure 6. There is no timing condition between RESETN and VBAT.
Note:
RESETN minimum duration for reliable detection is 100 μs.
Note:
RESETN is pulled up using an internal 1 MΩ+ resistance. In order to measure this signal accurately, use a very-high impedance probe.

Power States

Figure 7 represents the electrical states of the module and their transitions.

Figure 7. Electrical States and Transitions


There are four possible power modes:
  • Active mode: operational, UART on, RF on, LCPU/MCPU/DSP are running. Power consumption depends on workload and transmit power level.
  • Standby mode: Same as active mode, except RF off.
  • Sleep mode: MCPU/LCPU/DSP are power gated, UART off, RAM content is salvaged. Power level 300 µA circa.
  • Deep Sleep Mode: Only the power management unit (PMU) stays active. Power level 1 µA.

More information is given in the table below:

Table 21. Power Modes Description
Power Mode LTE Mode Available Interfaces
Active Connected (RF on) All interfaces
Standby Connected (RF off) All interfaces
Sleep Short eDRX idle duration RRC Idle WAKE pins (including RTS0/1)
Deep Sleep PSM idle, Long eDRX idle duration, radio-off, airplane WAKE pins (including RTS0/1)

PVDD_1V8 BIDIR Pads State in Sleep and Deep Sleep Mode

In Sleep and Deep Sleep mode, the Digital PVDD_1V8 bi-directional I/Os are turned off and behave like 50 MΩ high-impedance pads. Pull-ups / pull-downs are therefore mandatory on output pads to maintain a steady voltage level. Please refer to the EVK reference schematics for an implementation example.

PMU_5V IN Pads State in Deep Sleep Mode

In Deep Sleep mode the digital PMU_5V inputs are turned off and behave like 180 MΩ high-impedance pins.

Table 22 gives the values of the measured leakage current (measurements taken on silicon) for the PMU wake inputs.

Table 22. Measured Leakage Current for the PMU Wake Inputs
Minimum Typical Maximum
3 nA 4 nA 12 nA

Table 23 shows values of the external pull-up/pull-down resistor to be used at the PMU wake inputs pads.

Table 23. External Pull-up/Pull-down Resistor at PMU Wake Input Pads
Minimum Typical Maximum
1 kΩ 10 kΩ 100 kΩ

Table 24 details the PMU wake input pulses detection mechanism timings.

Table 24. PMU Wake Input Pulses Detection Mechanism Timings
Maximum pulse width guaranteed to be ignored Minimum pulse width guaranteed to be recognised
11.1 ns 100 µs

Table 25 provides the internal pull-up current range at RESETN.

Table 25. Internal Pull-Up Current at RESETN Pad
Minimum Typical Maximum
73.5 nA 100 nA 160.5 nA

Digital I/O Characteristics

This section details the voltage and current characteristics of the various I/O pads of the GM02SP.

The I/Os belong either one of two power groups:
  • PVDD_1V8
  • PMU_5V
The operational voltage range of both power groups is described in Table 26 and Table 27.
CAUTION:
Designers must ensure that the input voltage on any of the I/O pads never exceeds the VIH of the power group they belong to.

See Table 26 for the digital I/O characteristics of the different I/O pads. Refer to each interface of the GM02SP in chapter Interfaces for the power group and I/O pad type of each pad. Note that IN pads are inputs only whereas BIDIR can be both inputs and outputs.

Table 26. DC Ratings for Digital I/Os, PVDD_1V8 Power Group
Symbol Minimum Maximum Unit
VIH — Input HIGH level 1.26 3.3 V
VIL — Input LOW level 0 0.54 V
VOH — Output HIGH voltage 1.44 1.8 V
VOL — Output LOW voltage 0 0.36 V
IOH — HIGH level source current 0 220 mA
IOL — LOW level sink current 0 221 mA
IRPU — Input pull-up resistor current 15 µA
RRPU — Input pull-up resistance 27 34 kΩ
IRPD — Input pull-down resistor current 15 µA
RRPD — Input pull-down resistance 27 34 kΩ
VH — Input hysteresis 0.18 V
IPAD — Input leakage current, non-tolerant -1 1 µA
IOZ — Off-State leakage current 1 µA
Table 27. DC Ratings for Digital I/Os, PMU_5V Power Group
Symbol Minimum Maximum Unit
VIH — Input HIGH level 0.8 VBAT + 0.6 (max. 5.5) V
VIL — Input LOW level 0 0.2 V

RF Performance

Important:
For proper operation, the VSWR at the antenna pad must be better than 2:1 in conducted mode and 3:1 in radiated mode. A higher value could result either in poor RF performance, reduced Tx power or increased sideband/harmonic emission levels. Very high VSWRs can permanently damage the power amplifier.

It is recommended to add a DC blocking capacitor in series with the module RF input/output pad (#90).

RF Sensitivity

The GM02SP exhibits the following typical RF sensitivity at 2.5 V:

Table 28. RF Sensitivity
Band Typical Sensitivity
Low Bands: B5, B8, B12, B13, B14, B17, B18, B19, B20, B26, B28, B85 -105 dBm
High bands: B1, B2, B3, B4, B25, B66 -106 dBm
CAUTION:
The maximum safe RF input power is 3 dBm.
In CATM mode, the sensitivity is measured over a 6 RB (Resource Block) channel (1.2 MHz). In NB-IoT mode, the sensitivity is measured over a single RB (200 kHz).

RF Output Power

The GM02SP maximum output power within the recommended operating range (from 2.5 to 5.5 V) is given in Table 29.

Table 29. RF Max Output Power
Bands Output Power
All Bands 23 dBm ± 1 dB

RF performance at 2.2 V

While it is not recommended to operate the GM02SP in the range 2.2 to 2.5 V, the RF section will continue to work normally, albeit with reduced TX output power as shown in Table 30 below.

Table 30. RF Performance at 2.2 V compared to 2.5 V
Temperature Sensitivity Loss Output Power Loss
-30 °C No loss 1.1 dB
25 °C No loss 1.1 dB
85 °C No loss 1.7 dB

Power Supply Dimensioning

This section provides guidance to designers working on the power supply or selecting a suitable battery to power the GM02SP.

Overview

The current consumption of the GM02SP peaks before every TX sub-frame as shown in Figure 8. In this figure, the time division is 50 µs. Around 150 µs from the start, two current pulses peaking 34% higher than the average current consumption during the 23 dBm TX tone which follows can be observed.

Figure 8. Current Consumption in TX Sub-Frame


Peak Current Measurement Method

Sequans recommends to use the setup represented in Figure 9 for peak current measuring. This setup was used to record the measurements presented in Table 31. Pay attention that:
  1. Voltage probes are placed close to module VBAT input.
  2. Voltage probes accuracy is calibrated using a current probe.
  3. A large capacitance Cbatt is placed close to the VBAT pin to simulate a battery and screen the device from the parasitic inductances of the cables and tracks.
  4. 2 × 22 µF capacitors (Cext) are placed between the voltage probes and the module VBAT input to soften the current peaks.
Figure 9. Setup for Current Peak Measurement


Peak Current Measurement

Table 31 gives the peak current values measured on the setup shown on Figure 9 for different voltages and temperatures.

Table 31. Peak Current Measurements (in mA)
Input Voltage T = -40°C T = -30°C T = +25°C T = +85°C
5.5 V 328 305 263 268
3.8 V 475 438 444 479
2.5 V 705 667 679 741
2.2 V 676 640 652 717

Margin

Important:
It is recommended that designs potentially sensitive to the current peaks described in this section use the recommended Cext 2 × 22 µF and dimension the power supply with an extra 20% margin w/r to the values provided in this section.

Module’s Total Capacitance and Inductance

The module’s sum of internal capacitance (positive side tolerance) is 115 µF.

The module’s sum of internal inductance (positive side tolerance) is 5.3 µH.

Maximum Electrical Ratings

Table 32. Maximum Electrical Ratings
Parameter Minimum Maximum
Supply Voltage VBAT -0.2 V 5.5 V
I/Os in Power Group PVDD_1V8 -0.2 V 4.125 V
I/Os in Power Group PMU_5V -0.2 V 6.0 V

Total Capacitance and Inducatance

The total capacitance of the GM02SP is 115 µF. Total inductance is 5.3 µH.

These values represent the internal capacitance and inductance of the module and must be considered when calculating the total Ci and Li of the end product. The sum of the module's Ci and Li and any external components must remain within the safe range specified by the target hazardous zone classification.
Important:
For safety considerations, the total capacitance and inductance of the module and its connected circuitry must not exceed the maximum allowable limits defined by the applicable certification (e.g., ATEX, IECEx). It is the responsibility of the end-product manufacturer to ensure that the final product complies with the safety requirements, including proper assessment of the total capacitance and inductance in the system.

Thermal Considerations

Special attention needs to be given to thermal dissipation.

The outer layers of the host board must be covered in as many wide copper areas as possible, and those must be stitched with evenly spaced ground vias. Care must be taken that no air gap exists along the thermal path from the GM02SP to the dissipating copper area(s). Gaps can be filled with heat conducting materials such as GapPad™.

The Gxx pads should be tied to a large ground plane on the customer's PCB layer 1. It is also recommended to have the Gxx pads area on the PCB stitched with through ground vias to improve thermal dissipation.

If the host board is piggybacked over a larger board, the aforementioned heat dissipation considerations should be applied to both the main and the daughter board.

Use the AT command AT+SQNTMON to monitor the current temperature of the modem and implement alert thresholds. The accuracy of the reported temperature is within ± 3°C.

Mechanical Characteristics

Package Description

The module footprint is (16.3 ± 0.15) mm × (17.0 ± 0.15) mm × 2.30 mm (max.).

See below for the other dimensions.

The GM02SP weighs 1.43 g.

Hardware Module Dimensions

Figure 10. Module Top and Side Views


Figure 11. Module PCB Views


Figure 12. Details of chamfered central ground pad G1


Table 33. Module Dimensions (mm)
Dimension Value (mm)
L 16.3 ± 0.15
W 17.0 ± 0.15
T 2.3 max (2.2 typical)
T0 0.8 max
L1 0.5 ± 0.1
W1 0.7 ± 0.1
L2 0.8 ± 0.1
W2 0.8 ± 0.1
a1 2.25 ± 0.1
a2 3.05 ± 0.1
a3 1.45 ± 0.1
a4 2.45 ± 0.1
a5 6.5 ± 0.1
b1 2.0 ± 0.1
b2 3.0 ± 0.1
b3 3.1 ± 0.1
b4 5.5 ± 0.1
b5 5.95 ± 0.1
P1 0.3 ± 0.1
P2 0.3 ± 0.1
P3 0.4 ± 0.1
P4 0.4 ± 0.1

Laser Marking

Figure 13. GM02SP Laser Marking


Notes:
  1. The triangle in the bottom-right corner provides pin #1 location.
  2. FCC ID: 2AAGMGM02SA
  3. IC: 12732A-GM02SA
  4. IMEI:XXXXXXXXXXXXXXX
  5. S/N:GPEYYMMDDNNNNSSS (16 digits)
    • GPE: reserved, value subject to change at Sequans’s discretion (3 digits);
    • YYMMDD: Manufacturing Date (YY:Year;MM:Month,DD:Day);
    • NNNN: Panel counter (from 0001~9999);
    • SSS: Piece location on panel (from 001~036)
  6. 2D marked “a” refer to IMEI Barcode
  7. 2D marked “b” refer to S/N Barcode
  8. XXX represents the country of origin, and can be either PRC for China or VN for Vietnam.

Environmental Conditions

Table 34. GM02S Operating Conditions
Parameter Range Description
Normal Operating Temperature 22 -30 to +85°C 3GPP Compliant Operating Temperature.
Extended Operating Temperature 23 -40 to +85°C Operation with Possible Penalty in RF Performances.
Relative Humidity 10 - 85% Non condensing.

Packing

The GM02SP is delivered in Tape-and-Reel. Details are provided in the figures below.

Figure 14. Packing Modules in Reels
Figure 15. Packing Reels in Boxes


The full box set weights about 5.95 kg.

The label attached to reels, vacuum bags, and the PP boxes is shown below, as is the label attached to the cardboard box (which contains 3 PP boxes).
Important:
Starting 2026, the reel and cardboard box labels have changed. In the following figures, the labels in use before 2026 are tagged ‘pre-2026’ while the new ones are tagged ‘2026+’.
On both labels, xxx in the COO (Country Of Origin) field stands either for CHINA or VIETNAM.
Figure 16. Reel, Vacuum Bag and PP Box Label (2026+)
Figure 17. Cardboard Box Label (2026+)
Figure 18. Reel, Vacuum Bag and PP Box Label (pre-2026)


Figure 19. Cardboard Box Label (pre-2026)


Storage and Mounting

The GM02SP module is Moisture Level 3 rated as per JEDEC industrial standard.

The GM02SP is JEDEC J-STD-033D compliant and can be stored at T < 40 °C and relative humidity < 90%.

The GM02SP can withstand up to three reflows at a maximum of 245°C.

Table 35. Reflow Profile
Profile Feature
Solder Paste Alloy Sn 96.5/Ag 3.0/Cu 0.5 (Lead Free solder paste)
Peak Package Body Temperature 235 °C to 245 °C
Fusion Time

Temp: 217 to 245 °C

Duration: 60 to 90 s
Pre-heat / Soak

Temp: 150 to 217 °C

Time: 90 to 120 s
Ramp-up Rate < 3 °C/s
Ramp-down Rate -3 to 0 °C/s
Air composition N2, O2 contents less than 1,500 ppm
Figure 20. Reflow Profile Parameters


Recommended stencil thickness: 0.12 to 0.13 mm, to allow for enough solder paste and avoid risks of dry soldering and wrapage issues.

Following reflow soldering, the GM02SP can be washed with deionised RO water to remove any remaining flux. The module then needs a single backing at 125 °C during 16 hours. The module's package may be slightly discoloured during baking.

Reliability Specifications for Hardware Rev. 3

The GM02SP has been tested against Sequans's industrial reliability specification as described in Table 36.

Table 36. Reliability Test Plan
Item Test conditions Standard #Samples Result
Preconditioning

(a) Bake: 125°C / 24 hours

(b) MSL3: 30°C/60% RH, 192 hrs

(c) SAT (CSAM & TSCAN)

(d) X-ray

(e) Reflow 3 cycles at Tp: 250 ±2°C

(f) SAT (CSAM & TSCAN)

 JESD22-A113 225 PASS
TC

Temperature Shock Cycling (TC):

-40°C to +85°C air to air, 20 minutes, ramp rate 20°C/minute, 1000 cycles

JESD22-A104 25 PASS
THB

Temperature Humidity Bias Test

+85°C, 85 % RH, Vcc Max, Read Point at 168/500/1,000 hrs

 JESD22-A101 25 PASS
HAST
  1. 130/100 °C, 85% RH, Vcc max
  2. Electrical test
 JESD22-A110 25 PASS
Environmental Testing - A Cold

Environmental Testing

Test A Cold. -40°C, 500 hrs

 IEC60068-2-1 JESD22-A119 25 PASS
Environmental Testing - B Dry Heat

Environmental Testing

Test B Dry Heat. +85°C, 500 hrs

 IEC60068-2-2 JESD22-A103 25 PASS
HTOL

High Temperature Operating Test

85 °C, Vcc max, Tx: 50% / Rx: 50%. Read Point at 283/500/1,000 hrs

 N/A 50 PASS
LTOL

Low Temperature Operating Test

<50 °C, Vcc max, Tx: 50% / Rx: 50%. Read Point at 283 hrs

 JESD22-A108 25 PASS
High Temperature Storage Test (HST) 150 °C/1,000 hours JESD22-A103 25 PASS
Intermittent Operating Life (IOL)
  • Power on/off
  • 75 °C
  • 5,000 cycles
 N/A 25 PASS
Power and Temperature Cycling Test Condition A – -40 to +85 °C JESD22-A105 25 PASS
Shock

Mechanical Shock (MS)

(Half Sine, 500G, 1.0 ms, 1 shock for each ±axis)

 DIN IEC 68-2-27 15 PASS
Drop
Drop Test:

  1. Height: 80 cm;

  2. Concrete or steel;
  3. All surfaces and edges;
  4. 1,500 g / 0.5 ms
 DIN IEC 68-2-31 ETS 300019-2-7 15 PASS
Vibration

Vibration Test (Vib) Sweep-Sine Vibration.

Sinusoidal, 10 ~ 500 Hz, 1.0 octave/min, 10 sweep cycles for 2 hr for each axis.

DIN IEC 68-2-6 EIA/TIA 571 §4.1.1.2 15 PASS
ESD HBM Start: ±1000V, Stop:± 1500V JS-001JESD22-A114 12 PASS
CDM Start: ±250V, Stop: ±500V JS-002STM5.3.1 12 PASS
TCT

Temperature Change Test

10 cycles; 1 cycle has the following steps (roughly 7+ hrs):

  • Ramp from ambient (23°C) to -40°C at 3°C/min.
  • 3 hrs at - 40°C
  • Ramp to 85°C at 3°C/min
  • 3 hrs at 85°C
  • Ramp from 85°C to 23°C at 3°C/min
 IEC60068-2-14 25 PASS

Mean Time To Failure (MTTF)

The MTTF at 60% confidence level is based on the following results/assumptions derived from the ‘HTOL’ test as described in the table above:
  • There was no failure recorded on a cumulative Dh=50,000 hour run (50 devices tested for 1000 hours), which, at a confidence level of 60%, results in a failure rate Fr equal to 0.93.
  • Stress test temperature Ts is 75 °C.
  • The thermal activation energy Ev is assumed to be 0.7 eV.
The MTTF is given by the following formula: MTTF = A f × D h F r where: A f = exp  ( E v k ( 1 T u  -  1 T s ) ) ,k being the Boltzmann constant and Tu the usage temperature.

Considering the figures given above, the resulting MTTF for the GM02SP at 60% confidence level and a usage temperature Tu of 25°C is 313 years. At a usage temperature Tu of 55°C, this figure drops to 25.9 years.

GNSS Characteristics

Table 37. GNSS Generic Features
Generic Features Comments
GPS Constellation Support L1 band
On-device GNSS navigation mode, using satellite broadcast ephemerides and almanac Not recommended for low power consumption; back-up mode when no GNSS cloud assistance is available
Assisted on-device GNSS navigation mode using live assistance (Ephemerides) downloaded from the cloud
  • Recommended operational mode
  • Using Sequans's cloud
Three choices of RF capture lengths: short, medium and long Flexible trade-off between sensitivity, accuracy, time to first fix and power consumption constraints
Table 38. Specific Features Support
Specific Features Support with Partner Comments
On-device GNSS pre-processing mode, followed by on-cloud final navigation
  • Support still in ‘beta’ status
  • Using Sequans’s cloud
Table 39. Application Features
Application Features Comments
Non-concurrent LTE Tx/Rx with GNSS processing GNSS fix can be acquired when AT+CFUN=0 or AT+CFUN=4
Concurrent support of GNSS with PSM mode As long as the PSM exit timer is not expected to fire within the next 120 s.
Table 40. Performance
Performance Comments

Sensitivity (lab; open-sky conditions and long RF capture):

  • -146 dBm, Cold Start
  • -150.5 dBm, Warm Start
  • -153.3 dBm, Hot Start
  • Cold Start: no valid assistance
  • Warm Start: valid assistance pre-loaded, no approximative position known
  • Hot Start: valid assistance pre-loaded and position known within a 100 km radius circle

Accuracy (lab; open-sky conditions and long RF capture):

  • CEP 50: < 3.5 meters
  • CEP 95: < 5.5 meters

Accuracy (live condition; antenna with full sky visibility and long RF capture)

  • CEP 50: < 9.0 meters

Time-To-First-Fix (lab; open-sky conditions & all RF capture lengths)

  • Hot Start: < 2.0 sec. average
  • Cold Start: < 28 sec. (worst case)

Regulatory Approval

FCC Regulatory Approval

FCC-ID: 2AAGMGM02SA (single modular approval)

FCC-ID: 2AAGMG02SA (single modular approval)

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

This device complies with parts 22/24/27/90 of the FCC Rules.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
  1. This device may not cause harmful interference.
  2. This device must accept any interference received, including interference that may cause undesired operation.

Installation/Integration

This above identified radio module is not intended to be provided to end-users but is for installation by OEM integrators only.

Sequans's module integration guidelines must be closely followed.

Compliance of host integrations of the module is limited to hosts adaptation designs which are identical to Sequans' reference design.

Host integrations with adaptation designs deviating from Sequans' reference design require either filing a Class 2 Permissive Change to this modular approval or separate approval for the end-Product under its own FCC ID.

Host integrations with co-located (simultaneously operating) radio transmitters must be evaluated in accordance with FCC multi-transmitter rules and may require either filing a Class 2 Permissive Change to this modular approval or separate approval for the end-Product under its own FCC ID. Dependent on the result of the evaluation.

An inquiry to the FCC or a TCB is urgently recommended.

Antennas

This radio transmitter has been tested and approved by the FCC to operate with the antennae listed below:

  • Aaronia AG OmniLOG® 90200 – max. antenna gain = 2 dBi.
  • Fractus Antennas TRIO mXTEND™ (FR01-S4-210) – max. antenna gain = 2.4 dBi.
To comply with both the FCC maximum EIRP limits and with RF Exposure rules, the maximum antenna gain for the operation bands are:
Band Frequency range (MHz) Maximum Antenna Gain (dBi)
B2 1850 – 1910 8.0
B4 1710 – 1755 5.0
B5 824 – 849 9.4
B8 897.5 - 900.5 9.77
B12 699 – 716 8.6
B13 777 – 787 9.1
B17 704 – 716 8.7
B25 1850 – 1915 8.0
B26 814 – 849 9.4
B66 1710 – 1780 5.0
B85 698 – 716 8.6

The use of an antenna having a gain greater than the above indicated in any of those specified bands is strictly prohibited.

RF Exposure Safety

This module complies with the FCC RF exposure limits and has been evaluated in compliance with mobile exposure conditions.

The equipment must be installed and operated with minimum distance of 20 cm of the human body.

End-Product RF Exposure Safety

Integrations of this module into end-products which are intended for portable use, i.e. less than 20 cm distance between its radiating structures (antenna) and the body of nearby persons, or which otherwise put additional technical requirements, like Hearing Aid compatibility, require either filing a Class 2 Permissive Change to this modular approval or separate approval for the end-Product under its own FCC ID.

Compliance with FCC Rule Part 15B

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

End-product Compliance with FCC Rule Part 15B (Unwanted Emission Limits for Digital Device)

If the OEM of the end-product fully complies with the above described reference design, they can inherit and rest on the existing modular approval for RF compliance.

The OEM of the end-product remains still responsible to show compliance of the overall end-product with the FCC limits for unwanted conducted and radiated emissions from the digital device (unintentional radio) portion of such end-product (commonly addressed as part 15B compliance or similar).

End-Product Labelling

The module's FCC ID must either be visible from the exterior of the end-product (e.g. per window) or per electronic display, or shall be displayed on an additional exterior label per the following or similar string:

Contains FCC ID: 2AAGMGM02SA

Contains FCC ID: 2AAGMG02SA

Further labelling requirements may apply depending on the FCC rule parts relevant to the end-product.

End-product User manual

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module.

The user manual of the end-product shall include all the applicable regulatory information/warnings.

ISED Regulatory Approval (English)

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

This device complies with ISED Radio Standards Specifications RSS-130, RSS-132, RSS-133, RSS-139.

Installation/Integration

This above identified radio module is not intended to be provided to end-users but is for installation by OEM integrators only. The integration guidelines must be closely followed.

Compliance of host integrations of the module is limited to hosts adaptation designs which are identical to the reference design.

Host integrations with adaptation designs deviating from the reference design require either filing a Class 2 Permissive Change to this modular approval or separate approval for the end-Product under its own IC.

Host integrations with co-located (simultaneously operating) radio transmitters must be evaluated in accordance with ISED multi-transmitter rules and may require either filing a Class 2 Permissive Change to this modular approval or separate approval for the end-Product under its own IC. Dependent on the result of the evaluation.

An inquiry to the ISED or an FCB is urgently recommended.

Antennas

This radio transmitter has been tested and approved by the ISED to operate with the antennae listed below:

  • Aaronia AG OmniLOG® 90200 – max. antenna gain = 2 dBi.
  • Fractus Antennas TRIO mXTEND™ (FR01-S4-210) – max antenna gain = 2.4 dBi.

To comply with both the ISED maximum EIRP limits and with RF Exposure rules, the maximum antenna gain for the operation bands are:

Band Frequency Range (MHz) Maximum Antenna Gain (dBi)
B25 1850 – 1915 8.0
B2 1850 – 1910 8.0
B66 1710 – 1780 5.0
B4 1710 – 1755 5.0
B5 824 – 849 6.1
B85 698 – 716 5.6
B12 699 – 716 5.6
B17 704 – 716 5.6
B13 777 – 787 5.9

The use of an antenna having a gain greater than the above indicated in any of those specified bands is strictly prohibited.

RF exposure safety

This module complies with the ISED RF exposure limits and has been evaluated in compliance with mobile exposure conditions.

The equipment must be installed and operated with minimum distance of twenty centimetres of the human body.

End-product RF exposure safety

Integrations of this module into end-products which are intended for portable use, i.e. less than 20 cm distance between its radiating structures (antenna) and the body of nearby persons, or which otherwise put additional technical requirements, like Hearing Aid compatibility, require either filing a Class 2 Permissive Change to this modular approval or separate approval for the end-Product under its own IC.

Compliance with Interference-Causing Equipment Standard

This Class B digital apparatus complies with ISED’s Interference-Causing Equipment Standard ICES-003.

End-product compliance with Interference-Causing Equipment Standard

If the OEM of the end-product fully complies with the above described reference design, they can inherit and rest on the existing modular approval for RF compliance.

The OEM of the end-product remains still responsible to show compliance of the overall end-product with the applicable Interference-Causing Equipment Standards issued by the ISED.

End-product Labelling

The module's IC must either be visible from the exterior of the end-product (e.g. per window) or per electronic display, or shall be displayed on an additional exterior label per the following or similar string:

Contains IC: 12732A-GM02SA

Further labelling requirements may apply depending on the applicability of other Radio Standard Specifications relevant to the end-product.

End-product User manual

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module.

The user manual of the end-product shall include all the applicable regulatory information/warnings.

Pending.

Autorisation Réglementaire de l'ISDE (Français)

Les changements ou modifications non expressément approuvés par la partie responsable de la conformité peuvent annuler l'autorisation de l'utilisateur à utiliser l'équipement.

Cet appareil est conforme aux spécifications des normes radio ISDE RSS-130, RSS-132, RSS-133, RSS-139.

Installation/Intégration

Le module radio identifié ci-dessus n'est pas destiné à être fourni aux utilisateurs finaux, mais est destiné à être installé uniquement par des intégrateurs OEM. Les directives d'intégration doivent être suivies à la lettre.

La conformité des intégrations hôtes du module est limitée aux conceptions d'adaptation des hôtes qui sont identiques à la conception de référence.

Les intégrations hôtes avec des conceptions d'adaptation s'écartant de la conception de référence nécessitent soit le dépôt d'une modification permissive de classe 2 à cette approbation modulaire, soit une approbation distincte pour le produit final sous son propre CI.

Les intégrations hôtes avec des émetteurs radio colocalisés (fonctionnant simultanément) doivent être évaluées conformément aux règles multi-émetteurs ISDE et peuvent nécessiter soit le dépôt d'une modification permissive de classe 2 à cette approbation modulaire, soit une approbation distincte pour le produit final sous son propre CI. Cela dépend du résultat de l'évaluation.

Une demande de renseignements auprès de l'ISDE ou d'un FCB est recommandé de toute urgence.

Antennes

Cet émetteur radio a été testé et approuvé par l'ISDE pour fonctionner avec les antennes énumérées ci-dessous :

• Aaronia AG OmniLOG® 90200 – gain d'antenne maximal = 2 dBi

• Fractus Antennas TRIO mXTEND™ (FR01-S4-210) – gain d'antenne maximal = 2,4 dBi

Pour se conformer aux limites EIRP maximales de l'ISDE et aux règles d'exposition aux fréquences radio, le gain d'antenne maximal pour les bandes de fonctionnement est :

Bande Limites de bande (MHz) Gain maximal d'antenne (dBi)
B25 1850 – 1915 8.0
B2 1850 – 1910 8.0
B66 1710 – 1780 5.0
B4 1710 – 1755 5.0
B5 824 – 849 6.1
B85 698 – 716 5.6
B12 699 – 716 5.6
B17 704 – 716 5.6
B13 777 – 787 5.9

L'utilisation d'une antenne ayant un gain supérieur à celui indiqué ci-dessus dans l'une des bandes spécifiées est strictement interdite.

Sécurité d'exposition aux RF

Ce module est conforme aux limites d'exposition aux RF de l'ISDE et a été évalué conformément aux conditions d'exposition mobile.

L'équipement doit être installé et utilisé à une distance minimale de 20 cm du corps humain.

Sécurité d'exposition aux RF du produit final

L'intégration de ce module dans des produits finaux destinés à une utilisation portable, c'est-à-dire à une distance inférieure à 20 cm entre ses structures rayonnantes (antenne) et le corps des personnes à proximité, ou qui imposent des exigences techniques supplémentaires, comme la compatibilité avec les prothèses auditives, nécessite soit le dépôt d'une modification permissive de classe 2 à cette approbation modulaire, soit une approbation distincte pour le produit final sous son propre CI.

Conformité aux normes sur le matériel brouilleur

Cet appareil numérique de classe B est conforme à la norme NMB-003 de l'ISDE sur les équipements brouilleurs.

Conformité du produit final à la norme sur les équipements brouilleurs

Si le fabricant d'équipement d'origine du produit final est entièrement conforme à la conception de référence décrite ci-dessus, il peut hériter et s'appuyer sur l'approbation modulaire existante pour la conformité RF.

Le fabricant d'équipement d'origine du produit final reste toujours responsable de démontrer la conformité du produit final global aux normes applicables sur les équipements brouilleurs émises par l'ISDE.

Étiquetage du produit final

Le circuit intégré du module doit être visible de l'extérieur du produit final (par exemple, par fenêtre) ou par affichage électronique, ou doit être affiché sur une étiquette extérieure supplémentaire conformément à la chaîne suivante ou similaire :

Contient le circuit intégré : 12732A-GM02SA

D'autres exigences d'étiquetage peuvent s'appliquer en fonction de l'applicabilité d'autres spécifications de normes radio pertinentes pour le produit final.

Manuel d'utilisation du produit final

L'intégrateur OEM doit veiller à ne pas fournir d'informations à l'utilisateur final concernant la manière d'installer ou de retirer ce module RF dans le manuel d'utilisation du produit final qui intègre ce module.

Le manuel d'utilisation du produit final doit inclure toutes les informations/avertissements réglementaires applicables.

ACMA Regulatory Marking



RE-D Regulatory Safety Notice

CAUTION:
Equipment must be supplied by ES1, PS1 circuits according to the standard EN 62368-1.

UKCA Regulatory Marking



Acronyms

Acronym Definition
ADC Analogue to Digital Converter
CPU Central Processing Unit
DL Downlink
ESD Electro-static discharge
GND Ground
GNSS Global Navigation Satellite System
GPIO General Purpose Input Output
GPS Global Positioning System
I/O Input/Output
I²C Inter-Integrated Circuit interface
IMEI International Mobile Equipment Identity
IP Internet Protocol
JTAG Joint Test Action Group
LGA Large Grid Array
LNA Low-Noise Amplifier
GNSS Global Navigation Satellite System
LTE Long Term Evolution, or 4G. Standard is developed by the 3GPP.
MIMO Multiple In Multiple Out
NAS Network Access Server
PCM Pulse-Code Modulation
PHY Physical Layer
RED European Radio Equipment Directive
SAW Surface Acoustic Wave (filter)
RF Radio Frequency
RoHS Restriction of Hazardous Substances
Rx Reception
S/N or SN: Serial Number
SIM Subscriber Identification Module
SMS Short Message Service
SPI Serial Peripheral Interface
Tx Transmission
UART Universal Asynchronous Receiver Transmitter
UE User Equipment
UL Uplink
USB Universal Serial Bus
1 In the USA this band is limited to 897.5 – 900.5 MHz.
2 Alternate functions will be available in future versions via SW upgrade.
3 UART pad types’s electrical characteristics are detailed in Table 26 and Table 27.
4 USIM pad types electrical characteristics are detailed in Table 26 and Table 27.
5 SIM0_DETECT is active high (high when a card is present, low when no card is present).
6 See range of values in Table 18.
7 SIM0_VCC can source up to 30 mA.
8 Pad types electrical characteristics are detailed in Table 26.
9 I²C pad types’ electrical characteristics are detailed in Table 26.
10 Alternate functions will be available in future versions via SW upgrade.
11 PCM pad types’s electrical characteristics are detailed Table 26.
12 Alternate functions will be available in future versions via SW upgrade.
13 SPI pad types’ electrical characteristics are detailed in Table 26.
14 This pin is currently unavailable.
15 Functions will be available in future versions via SW upgrade.
16 Pad types’ electrical characteristics are detailed in Table 26 and Table 27.
17 JTAG pad types’s electrical characteristics are detailed in Table 26.
18 See also Section USIM Interfaces.
19 Shorter rise times can trigger the ESD protection.
20 This is the maximum current a HIGH level pad can source while retaining a correct logic value.
21 This is the maximum current that a LOW level pad can sink while retaining a correct logic value.
22 PCB temperature as measured by on-board thermistor. The correlation between oven temperature and the module on-board thermistor reading can be influenced by the specific thermal design of the customer’s device.
23 -40°C is the lowest temperature that the module can boot and start operation at.